Ultrasonic transducer device, ultrasonic measurement apparatus, head unit, probe, and ultrasonic imaging apparatus

ABSTRACT

An ultrasonic transducer device includes a substrate, an ultrasonic element array having a plurality of ultrasonic element rows each including a plurality of ultrasonic elements arranged along a first direction and electrically connected to each other, the plurality of ultrasonic element rows being arranged along a second direction intersecting with the first direction, and a plurality of common electrode wirings each configured to independently supply a common voltage to at least one of the ultrasonic element rows, the common electrode wirings extending along the first direction, one of the common electrode wirings being arranged between a pair of the ultrasonic element rows with respect to the second direction, the common electrode wirings being non-overlapped with the ultrasonic elements as viewed in a thickness direction of the substrate that is a normal direction of a surface of the substrate over which the ultrasonic element array is disposed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. patent application Ser. No.14/190,421, filed on Feb. 26, 2014, which claims priority to JapanesePatent Application No. 2013-038456, filed on Feb. 28, 2013. The entiredisclosures of U.S. patent application Ser. No. 14/190,421 and JapanesePatent Application No. 2013-038456 are hereby incorporated herein byreference.

BACKGROUND

1. Technical Field

The present invention relates to an ultrasonic transducer device, anultrasonic measurement apparatus, a head unit, a probe, an ultrasonicimaging apparatus, and the like.

2. Related Art

An ultrasonic apparatus is known which emits ultrasonic waves from afront end of a probe toward a target object and detects ultrasonic waveswhich are reflected from the target object (for example, JapaneseUnexamined Patent Application Publication No. 2007-142555). For example,the ultrasonic apparatus is used as an ultrasonic imaging apparatuswhich is used in diagnosis by imaging inside the body of a patient orthe like. For example, a piezoelectric element is used as an ultrasonicelement which emits ultrasonic waves.

SUMMARY

A voltage amplitude which is applied to the piezoelectric element isdetermined with a potential of a common electrode of the ultrasonicelement as a reference. In the prior art, since common electrode wiringwhich is shared is connected with respect to all of the ultrasonicelements, impedance of the common electrode wiring is higher with theultrasonic elements which are farther from a common terminal whichsupplies the common voltage. As a result, there is a problem in that thepotential of the common electrode varies according to a driving signalwith the ultrasonic elements which are farther from the common terminaland the voltage amplitude which is actually applied to the ultrasonicelements is smaller.

According to several aspects of the present invention, it is possible toprovide an ultrasonic transducer device, an ultrasonic measurementapparatus, a head unit, a probe, an ultrasonic imaging apparatus, andthe like which are able to suppress a reduction in voltage amplitudewhich is applied to an ultrasonic element.

An ultrasonic transducer device according to one aspect includes asubstrate, an ultrasonic element array having a plurality of ultrasonicelement rows each including a plurality of ultrasonic elements arrangedalong a first direction and electrically connected to each other, theplurality of ultrasonic element rows being arranged along a seconddirection intersecting with the first direction, and a plurality ofcommon electrode wirings each configured to independently supply acommon voltage to at least one of the ultrasonic element rows, thecommon electrode wirings extending along the first direction, one of thecommon electrode wirings being arranged between a pair of the ultrasonicelement rows with respect to the second direction, the common electrodewirings being non-overlapped with the ultrasonic elements as viewed in athickness direction of the substrate that is a normal direction of asurface of the substrate over which the ultrasonic element array isdisposed.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the attached drawings which form a part of thisoriginal disclosure:

FIGS. 1A to 1C are configuration examples of an ultrasonic element.

FIG. 2 is a comparative example of an ultrasonic transducer device.

FIG. 3 is a waveform example of a voltage of a signal electrode of anultrasonic element and a voltage of a common electrode of an ultrasonicelement.

FIG. 4 is a characteristic example of voltage amplitude which is appliedbetween electrodes of an ultrasonic element in a comparative example.

FIG. 5 is a first configuration example of an ultrasonic transducerdevice.

FIG. 6 is a characteristic example of voltage amplitude which is appliedbetween electrodes of an ultrasonic element in an embodiment.

FIG. 7A is a characteristic example of distribution of radiated soundpressure in a comparative example and FIG. 7B is a characteristicexample of distribution of radiated sound pressure in an embodiment.

FIG. 8 is a second configuration example of an ultrasonic transducerdevice.

FIGS. 9A to 9C are first detailed configuration examples of anultrasonic transducer device.

FIGS. 10A to 10C are second detailed configuration examples of anultrasonic transducer device.

FIG. 11 is a configuration example of an ultrasonic measurementapparatus.

FIG. 12 is a layout configuration example of a first integrated circuitdevice and a second integrated circuit device.

FIG. 13 is a configuration example of a head unit.

FIGS. 14A to 14C are detailed configuration examples of a head unit.

FIGS. 15A and 15B are configuration examples of an ultrasonic probe.

FIG. 16 is a configuration example of an ultrasonic imaging apparatus.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following describes a preferred embodiment of the present inventionin detail. Here, the present embodiment described below is notgratuitously limited by the content of the present invention describedin the scope of the claims and the entire configuration described in thepresent embodiment is not necessarily essential as a means to solve theproblems in the present invention.

1. Ultrasonic Element

FIGS. 1A to 1C illustrate a configuration example of an ultrasonicelement 10 which is applied to an ultrasonic transducer device of thepresent embodiment. The ultrasonic element 10 (an ultrasonic transducerelement) has a vibrating film 50 (a membrane and a support member), anda piezoelectric element section. The piezoelectric element section has afirst electrode layer 21 (a lower electrode), a piezoelectric body layer30 (a piezoelectric body film), and a second electrode layer 22 (anupper electrode).

FIG. 1A is a planar diagram of the ultrasonic element 10 which is formedon a substrate 60 (a silicon substrate) viewed from a direction which isorthogonal to the substrate on an element forming surface side. FIG. 1Bis a cross sectional diagram illustrating a cross section along AA′ inFIG. 1A. FIG. 1C is a cross sectional diagram illustrating a crosssection along BB′ in FIG. 1A.

The first electrode layer 21 is formed by, for example, a metal thinfilm on an upper layer of the vibrating film 50. The first electrodelayer 21 may be wiring which extends to an outer side of an elementforming region as shown in FIG. 1A and is connected to the adjacentultrasonic element 10.

The piezoelectric body layer 30 is formed using, for example, a PZT(lead zirconate titanate) thin film and is provided so as to cover atleast a portion of the first electrode layer 21. Here, the material ofthe piezoelectric body layer 30 is not limited to PZT, and for example,lead titanate (PbTiO₃), lead zirconate (PbZrO₃), lanthanum-modified leadtitanate ((Pb, La)TiO₃), and the like may be used.

The second electrode layer 22 is formed using, for example, a thin metalfilm and is provided so as to cover at least a portion of thepiezoelectric body layer 30. The second electrode layer 22 may be wiringwhich extends to an outer side of the element forming region as shown inFIG. 1A and is connected to the adjacent ultrasonic element 10.

The vibrating film 50 (the membrane) is provided so as to block off anopening 40 using a two layer structure of, for example, an SiO₂ thinfilm and a ZrO₂ thin film. It is possible for the vibrating film 50 tosupport the piezoelectric body layer 30, the first electrode layer 21,and the second electrode layer 22, to vibrate according to expansionsand contractions of the piezoelectric body layer 30, and to generateultrasonic waves.

The opening 40 (a hollow region) is formed by etching using reactive ionetching (RIE) or the like from the rear surface (the surface whereelements are not formed) side of the substrate 60. The resonancefrequency of the ultrasonic waves is determined by the size of thevibrating film 50 which is able to vibrate according to the forming ofthe opening 40 and the ultrasonic waves are radiated to thepiezoelectric body layer 30 side (in a forward direction from behind thesurface of the diagram in FIG. 1A).

A first electrode of the ultrasonic element 10 is formed using one outof the first electrode layer 21 and the second electrode layer 22 and asecond electrode is formed using the other out of the first electrodelayer 21 and the second electrode layer 22. In detail, one out of aportion which is covered by the piezoelectric body layer 30 out of thefirst electrode layer 21 and a portion which covers the piezoelectricbody layer 30 out of the second electrode layer 22 forms the firstelectrode and the other portion of the first electrode layer 21 and thesecond electrode layer 22 forms the second electrode. That is, thepiezoelectric body layer 30 is provided to interpose the first electrodeand the second electrode.

The piezoelectric layer body 30 expands and contracts in an in-planedirection due to a voltage being applied between the first electrode andthe second electrode, that is, between the first electrode layer 21 andthe second electrode layer 22. The ultrasonic element 10 uses amonomorphic (unimorphic) structure where a thin piezoelectric element(the piezoelectric body layer 30) and a metal plate (the vibrating film50) are bonded, and warping is generated in order to maintain thedimensions of the vibrating film 50 which is bonded to the piezoelectricbody layer 30 when the piezoelectric body layer 30 expands and contractsin the plane. The vibrating film 50 vibrates with respect to a filmthickness direction due to an alternating current being applied to thepiezoelectric body layer 30, and ultrasonic waves are radiated due tothe vibration of the vibrating film 50. The voltage which is applied tothe piezoelectric body layer 30 is, for example, 10 to 30 V and thefrequency is, for example, 1 to 10 MHz.

It is possible to narrow the element pitch since it is possible toreduce the size of the elements compared to the bulk ultrasonic elementsdue to the ultrasonic elements being configured as described above. Dueto this, it is possible to suppress the generation of grating lobes. Inaddition, it is possible to configure a driving circuit using a circuitelement with low resistance to voltage since driving is possible usingvoltage amplitude which is small compared to bulk ultrasonic elements.

2. Comparative Example

FIG. 2 illustrates a comparative example of the ultrasonic transducerdevice of the present embodiment. A first direction D1 shown in FIG. 2corresponds to a slice direction in a scanning operation of anultrasonic beam and a second direction D2 which intersects with (forexample, is orthogonal to) the first direction corresponds to a scanningdirection in a scanning operation of an ultrasonic beam.

An ultrasonic transducer device 200 of the comparative example includesthe substrate 60, an ultrasonic element array 100 which is arranged onthe substrate 60, signal electrode wirings LS1 to LS9 which are arrangedon the substrate 60 along the first direction D1, signal terminals XA1to XA9 which are connected to ends of the signal electrode wirings LS1to LS9, signal terminals XB1 to XB9 which are connected to the otherends of the signal electrode wirings LS1 to LS9, common electrodewirings LC1 and LC2 which are arranged on the substrate 60 along thefirst direction D1, common terminals XC1 and XC2 which are connected toends of the common electrode wirings LC1 and LC2, common terminals XC3and XC4 which are connected to the other ends of the common electrodewirings LC1 and LC2, and common electrode wirings LY1 to LY20 where oneend is connected to the common electrode wiring LC1 and the other end isconnected to the common electrode wiring LC2.

The ultrasonic element array 100 has nine rows of ultrasonic elementrows SR which are arranged along the second direction D2 and theultrasonic element rows SR have twenty of the ultrasonic elements 10which are arranged along the first direction D1. That is, the ultrasonicelements 10 are arranged in the ultrasonic element array 100 in a matrixformation with 20 lines by 9 rows. One of the electrodes (for example,the lower electrodes) in each of the 1^(st) to the 9^(th) rows of theultrasonic elements 10 are respectively connected to the signalelectrode wirings LS1 to LS9 and the other of the electrodes (forexample, the upper electrodes) in each of the 1^(st) to the 20^(th)lines of the ultrasonic elements 10 are respectively connected to thecommon electrode wirings LY1 to LY20.

FIG. 3 symmetrically illustrates an example of waveforms of a voltageVsig from a signal electrode of the ultrasonic element 10 and a voltageVcom from a common electrode of the ultrasonic element 10. Since acapacity component can be seen between the electrodes of the ultrasonicelement 10, an electric current flows in the common electrode wiring viathe common electrode when the voltage Vsig from the signal electrodevaries and the voltage Vcom from the common electrode varies due towiring impedance in the common electrode wiring. Voltage amplitude ofthis variance is set as Vcp.

In the comparative example described above, the wiring impedance in thecommon electrode wiring increases from common terminals XC1 to XC4 tothe ultrasonic elements 10 approaching the center of the ultrasonicelement array 100 since the common terminals XC1 to XC4 are arranged inthe four corners of the ultrasonic element array 100. As a result, thevoltage amplitude Vcp of the common electrode increases approaching thecenter of the ultrasonic element array 100, and the actual voltageamplitude of the voltage (Vsig-Vcom) which is applied between theelectrodes in the ultrasonic element 10 is reduced.

FIG. 4 illustrates a characteristic example of voltage amplitude whichis applied between the electrodes in the ultrasonic element 10. Thecharacteristic example is the results of a simulation in a case of thecomparative example in FIG. 2 where a driving signal which is shared issupplied to the signal terminals XA5 and XB5 which are central, a fixedvoltage is supplied to the signal terminals XA1 to XA4, XA6 to XA9, XB1to XB4, and XB6 to XB9 which are on both sides, and a common voltagewhich is shared is supplied to the common terminals XC1 to XC4. Thefrequency of the driving signal was 3.5 MHz. Element positions 1 to 20on the horizontal axis are numbers for the lines of the ultrasonicelements and correspond to ultrasonic elements UE1 to UE20 which areconnected to the signal terminals XA5 and XB5.

As shown in FIG. 4, the voltage amplitude between the electrodesincreases closer to the ends of the ultrasonic element array 100 and thevoltage amplitude between the electrodes is smaller closer to thecenter. When there are deviations and a reduction in the voltageamplitude in this manner, there is a problem in that a reduction in thesound field, deviations in the sound field, or breaks in the sound fieldof an ultrasonic beam or the like may be generated.

3. Ultrasonic Transducer Device 3.1. First Configuration Example

FIG. 5 illustrates a first configuration example of the ultrasonictransducer device 200 of the present embodiment which is able to solvethe problems described above. Below, an example will be described in acase where the ultrasonic element array 100 is an array with a matrixformation of 8 lines by 64 rows, but the present embodiment is notlimited to this, and the values of m and n of m lines by n rows may bevalues other than m=8 and n=64.

Here, it is possible to adopt a transducer which is a type which uses apiezoelectric element as described above (a thin film piezoelectricelement) as the ultrasonic transducer device 200, but the presentembodiment is not limited to this. For example, a transducer which is atype which uses a capacitive element such as a c-MUT (CapacitiveMicro-machined Ultrasonic Transducer) may be adopted.

The ultrasonic transducer device 200 includes the substrate 60, theultrasonic element array 100 which is formed on the substrate 60, 1^(st)to 64^(th) one end side signal terminals XA1 to XA64 (first end signalterminals) which are formed on the substrate 60, 1^(st) to 64^(th) otherend side signal terminals XB1 to XB64 (second end signal terminals)which are formed on the substrate 60, 1^(st) to 64^(th) one end sidecommon terminals CA1 to CA64 (first end common terminals) which areformed on the substrate 60, 1^(st) to 64^(th) other end side commonterminals CB1 to CB64 (second end common terminals) which are formed onthe substrate 60, 1^(st) to 64^(th) signal electrode wirings LS1 to LS64which are formed on the substrate 60, and 1^(st) to 64^(th) commonelectrode wirings LC1 to LC64 which are formed on the substrate 60.

The ultrasonic element array 100 includes 1^(st) to 64^(th) ultrasonicelement rows SR1 to SR64 which are arranged along the second directionD2 (the scanning direction) and each of the ultrasonic element rows inthe ultrasonic element rows SR1 to sR64 includes eight of the ultrasonicelements 10 which are arranged along the first direction D1 (the slicedirection).

One end side common terminals CA1 to CA64 are arranged at one endportion of the ultrasonic element array 100 in the first direction D1.The other end side common terminals CB1 to CB64 are arranged at theother end portion of the ultrasonic element array 100 in the firstdirection D1. The one end side signal terminals XA1 to XA64 are arrangedat one end portion of the ultrasonic element array 100 in the firstdirection D1. The other end side signal terminals XB1 to XB64 arearranged at the other end portion of the ultrasonic element array 100 inthe first direction D1.

For example, the substrate 60 has a rectangular shape with the seconddirection D2 as the long-side direction, and the one end side commonterminals CA1 to CA64 and the one end side signal terminals XA1 to XA64are alternately arranged along a first long side HN1 of the rectangularshape. In addition, the other end side common terminals CB1 to CB64 andthe other end side signal terminals XB1 to XB64 are alternately arrangedalong a second long side HN2 of the rectangular shape.

The common electrode wirings LC1 to LC64 are arranged along the firstdirection D1 and are respectively connected to the ultrasonic elementrows SR1 to SR64. One end of the common electrode wirings LC1 to LC64 isconnected to the one end side common terminals CA1 to CA64 and the otherend of the common electrode wirings LC1 to LC64 is connected to theother end side common terminals CB1 to CB64.

If the ultrasonic element row SR1 is taken as an example, a commonvoltage which is the same voltage is supplied to the common terminalsCA1 and CB1, and the common voltage is supplied to the common electrodes(for example, the upper electrodes) of the ultrasonic elements 10 whichconfigure the ultrasonic element row SR1 via the common electrode wiringLC1. The common voltage is supplied via each of the common electrodewirings LC2 to LC64 in the same manner with respect to the ultrasonicelement rows SR2 to SR64.

In this manner, the length of wiring from the common terminal to theultrasonic element is short compared to the comparative exampledescribed above since the common electrode wirings are provided withrespect to each of the ultrasonic element rows, and in addition, thenumber of ultrasonic elements which are connected to the one line of thecommon electrode terminals is smaller. Due to this, it is possible forthe voltage amplitude which is applied between the terminals in theultrasonic element to approach the end and central sections of theultrasonic element array 100 and it is possible to suppress a reductionin the sound field in the center section.

Here, the common voltage which is the same voltage may be supplied tothe common terminals CA1 to CA64 (and to the corresponding commonterminals CB1 to CB64) or common voltages which are different voltagesmay be supplied. For example, in a case where there are the ultrasonicelement rows dedicated to transmission and the ultrasonic element rowsdedicated to reception, the common voltage with respect to theultrasonic element rows dedicated to transmission and the common voltagewith respect to the ultrasonic element rows dedicated to reception maybe voltages which are different.

The signal electrode wirings LS1 to LS64 are arranged along the firstdirection D1 and are respectively connected to the ultrasonic elementrows SR1 to SR64. One end of the signal electrode wirings LS1 to LS64 isconnected to the one end side signal terminals XA1 to XA64 and the otherend of the signal electrode wirings LS1 to LS64 is connected to theother end side signal terminals XB1 to XB64.

If the ultrasonic element row SR1 is taken as an example, a drivingsignal which has the same waveform and is the same voltage is suppliedto the signal terminals XA1 and XB1 and the driving signal is suppliedto the signal electrodes (for example, the lower electrodes) of theultrasonic elements 10 which configure the ultrasonic element row SR1via the signal electrode wiring LS1. The driving signal is supplied viaeach of the signal electrode wirings LS2 to LS64 in the same manner withrespect to the ultrasonic element rows SR2 to SR64.

Here, since there is wiring impedance in the signal electrode wiring anda capacity component of the ultrasonic elements, the driving signalwhich is applied to the signal terminals attenuates in accordance withbeing transmitted on the signal electrode wiring. In this point, sincethe driving signal is supplied from both ends of the signal electrodewiring in the present embodiment, it is possible to suppress attenuationof the driving signal compared to a case where the driving signal isonly applied from one end. In addition, deviation in the sound field isgenerated in the slice direction (the first direction D1) due toattenuation of the driving signal in a case where the driving signal isonly applied from one end, but it is possible to suppress deviation inthe sound field since the attenuation of the driving signal issymmetrical in the present embodiment.

Here, as described above, an example is described where the ultrasonicelement array 100 is an arrangement with a matrix formation of m linesby n rows, but the present embodiment is not limited to this and theultrasonic element array 100 may be an arrangement with an arrayformation where a plurality of unit elements (the ultrasonic elements)are arranged to have regularity in two dimensions. For example, theultrasonic element array 100 may be a zigzag arrangement. Here, thearrangement with a matrix formation is an arrangement with a gridformation of m lines by n rows and includes not only cases where thegrid is a rectangular shape but cases where the grid is changed to aparallelogram. The arrangement with a zigzag shape is an arrangementwhere m rows of the ultrasonic elements and m−1 rows of the ultrasonicelements are alternately lined up, the m rows of the ultrasonic elementsare arranged in odd lines out of (2 m−1) lines, and the m−1 rows of theultrasonic elements are arranged in even lines out of (2 m−1) lines.

FIG. 6 illustrates a characteristic example of voltage amplitude whichis applied between the electrodes in the ultrasonic element 10. Thecharacteristic example is the results of a simulation in a case of thefirst configuration example described above where the ultrasonic elementrows are configured into 20 lines by 9 rows (m=20 and n=9), a drivingsignal which is shared is supplied to the signal terminals XA5 and XB5which are in the center of the nine rows, a fixed voltage is supplied tothe signal terminals XA1 to XA4, XA6 to XA9, XB1 to XB4, and XB6 to XB9which are on both sides, and a common voltage which is the same voltageis supplied to the common terminals XC1 to XC9. The frequency of thedriving signal was 3.5 MHz. The element positions 1 to 20 on thehorizontal axis are numbered for the lines of the ultrasonic elements.

As shown in FIG. 6, there is a difference of approximately 1 V in thevoltage amplitude between the electrodes at the end and the centersections of the ultrasonic element array 100, but the reduction in thevoltage amplitude is substantially suppressed at the center sectioncompared to the comparative example in FIG. 4. In this manner, it ispossible to realize an improvement in sound pressure, suppression ofdeviations in the sound field, suppression of breaks in the sound fieldof an ultrasonic beam and the like since deviations and a reduction inthe voltage amplitude are suppressed in the present invention.

FIG. 7A and FIG. 7B illustrate a characteristic example of distributionof radiated sound pressure. FIG. 7A illustrates a characteristic examplewith the same conditions as the comparative example in FIG. 4 and FIG.7B illustrates a characteristic example with the same conditions as thepresent embodiment in FIG. 6. The horizontal axis represents a positionin a direction along an element row where a driving signal is appliedand x=0 mm corresponds to the center of the element row. Depthrepresents distance in a direction which is orthogonal to the plane ofthe substrate 60 from the substrate 60 to a measurement point.

In the comparative example, the highest sound pressure at a depth of 50mm is 2925 Pa and the highest sound pressure at a depth of 100 mm is1557 Pa. On the other hand, in the present embodiment, the highest soundpressure at a depth of 50 mm is 4825 Pa and the highest sound pressureat a depth of 100 mm is 2497 Pa. It is understood that there is asubstantial improvement in the highest sound pressure in the presentembodiment at any depth.

3.2 Second Configuration Example

In the first configuration example described above, a case is describedwhere one row of the ultrasonic element rows is connected to one channelwhich receives and transmits the same signal, but the present embodimentis not limited to this and a plurality of rows of the ultrasonic elementrows may be connected to one channel.

FIG. 8 illustrates a second configuration example of the ultrasonictransducer device as a configuration example in the case describedabove. An example will be described below in a case where two rows ofthe ultrasonic element rows are connected to one channel, but three ormore rows of the ultrasonic element rows may be connected to onechannel. In addition, a different number of rows of the ultrasonicelement rows may be connected to the respective channels.

The ultrasonic transducer device 200 includes the substrate 60, theultrasonic element array 100, the 1^(st) to 64^(th) one end side signalterminals XA1 to XA64, the 1^(st) to 64^(th) other end side signalterminals XB1 to XB64, the 1^(st) to 64^(th) one end side commonterminals CA1 to CA64, the 1^(st) to 64^(th) other end side commonterminals CB1 to CB64, 1^(st) to 128^(th) signal electrode wirings LS1to LS128, and the 1^(st) to 64^(th) common electrode wirings LC1 toLC64. Here, the constituent elements which are the same as theconstituent elements described in FIG. 5 are given the same referencenumerals and description is appropriately omitted.

The ultrasonic element array 100 includes 1^(st) to 128^(th) ultrasonicelement rows SR1 to SR128 which are arranged along the second directionD2 (the scanning direction).

The common electrode wirings LC1 to LC64 are each connected with tworows of the ultrasonic element rows. For example, the common electrodewiring LC1 is connected with the common electrodes (for example, theupper electrodes) in the ultrasonic elements 10 which configure theultrasonic element rows SR1 and SR2.

The signal electrode wirings LS1 to LS128 are respectively connectedwith the ultrasonic element rows SR1 to SR128. The one end side signalterminals XA1 to XA64 are each connected with one end of the two linesof the signal electrode wirings, and the other end side signal terminalsXB1 to XB64 are each connected with the other end of the two lines ofthe signal electrode wirings. For example, the signal electrode wiringLS1 is connected with the signal electrodes (for example, the lowerelectrodes) in the ultrasonic elements 10 which configure the ultrasonicelement row SR1, and the signal electrode wiring LS2 is connected withthe signal electrodes (for example, the lower electrodes) in theultrasonic elements 10 which configure the ultrasonic element row SR2.One out of the ends of the signal electrode wirings LS1 and LS2 areconnected with the signal terminal XA1 and the other ends of the signalelectrode wirings LS1 and LS2 are connected with the signal terminalXB1.

In this manner, it is possible to increase the number of the ultrasonicelements which are connected to one channel by connecting a plurality ofrows of the ultrasonic element rows to one channel. Due to this, it ispossible to improve the sound pressure of the transmission ultrasonicwaves.

Here, a case is described where one line of the common electrode wiringsis connected with one channel which receives and transmits the samesignal, but the present invention is not limited to this, and forexample, one line of the common electrode wirings may be connected witha plurality of channels or a plurality of lines of the common electrodewirings may be connected to one channel.

In the embodiment described above, for example, the ultrasonictransducer device 200 includes the ultrasonic element array 100 and thecommon electrode wirings (for example LC2) as shown in FIG. 5. Theultrasonic element array 100 has three rows (for example, SR1 to SR3) ofthe ultrasonic element rows where a plurality of the ultrasonic elements10 which are electrically connected are arranged in the first directionD1. The common electrode wiring (LC2) supplies a common voltage to onerow of the ultrasonic element rows (SR2) out of the three rows of theultrasonic element rows (SR1 to SR3). The three rows of the ultrasonicelement rows (SR1 to SR3) are arranged in the second direction D2 whichintersects with (for example, is orthogonal to) the first direction D1.The common electrode wiring (LC2) is arranged in the first direction D1and is arranged between two rows of the ultrasonic element rows (SR1 andSR3) which are positioned on the outer sides out of the three rows ofthe ultrasonic element rows (SR1 to SR3).

According to this, the common electrode wiring (LC2) is arranged betweenthe three rows of the ultrasonic element rows (SR1 to SR3) and it ispossible to supply a common voltage to at least one row of theultrasonic element rows (SR2) out of the three rows of the ultrasonicelement rows (SR1 to SR3) using the common electrode wirings (LC2). Dueto this, the length of common electrode wiring from the common terminalto the ultrasonic element is short and wiring impedance is reducedcompared to a case where the common electrode wirings are arranged atboth ends of the ultrasonic element array 100 as described in FIG. 6 andthe like. As a result, it is possible to suppress a reduction in theactual voltage amplitude even at the center section of the ultrasonicelement array 100, and it is possible to suppress a reduction in soundpressure and the like as described in FIG. 7B and the like.

Here, “arranged in the first direction D1 (or the second direction D2)”specifically refers to an arrangement along the first direction D1 (orthe second direction D2). For example, in a case where a plurality ofthe ultrasonic elements 10 are arranged along the first direction D1,this is not limited to a cases where the plurality of the ultrasonicelements 10 are lined up on a straight line along the first direction D1and the plurality of the ultrasonic elements 10 may be arranged in azigzag with respect to a straight line along the first direction D1.

Here, the three rows of the ultrasonic element rows are three arbitraryrows out of a plurality of the ultrasonic element rows which areincluded in the ultrasonic element array 100. For example, the threerows are the ultrasonic element rows SR1 to SR3. In this case, the tworows on the outer sides are the ultrasonic element rows SR1 and SR3 andthe common electrode wiring between the ultrasonic element rows SR1 andSR3 is the common electrode wiring LC2. Alternatively, the three rowsare the ultrasonic element rows SR1, SR3 and SR5. In this case, the tworows on the outer sides are the ultrasonic element rows SR1 and SR5 andthe common electrode wiring between the ultrasonic element rows SR1 andSR5 is the common electrode wiring LC2 or the common electrode wiringLC3. Alternatively, the three rows may be the ultrasonic element rowSR1, any of the ultrasonic element rows SR2 to SR63, and the ultrasonicelement row SR64. In this case, the two rows on the outer sides are theultrasonic element rows SR1 and SR64 and the common electrode wiringbetween the ultrasonic element rows SR1 and SR64 is any of the commonelectrode wirings LC2 to LC64.

In addition, in the present embodiment, the ultrasonic element array 100has a 1^(st) to an n^(th) of the ultrasonic element rows (for example,SR1 to SR64) which are arranged along the second direction D2 andinclude the three rows of the ultrasonic element rows (SR1 to SR3). Thecommon electrode wiring (LC2) supplies the common voltage to an i^(th)to a j^(th) of the ultrasonic element rows (for example, SR2) out of the1^(st) to the n^(th) of the ultrasonic element rows and is arrangedbetween a k^(th) of the ultrasonic element rows (SR1) and a k+1^(th) ofthe ultrasonic element rows (SR2) out of the i−1^(th) to the j^(th) ofthe ultrasonic element rows (SR1 and SR2).

Here, i and j are natural numbers such that i≦j≦n−1 and k is a naturalnumber such that i−1≦k≦j. For example, in a case where the commonelectrode wiring (LC2) supplies the common voltage to the second of theultrasonic element rows (SR2 where i=j=2) as in FIG. 5, the commonelectrode wiring (LC2) may be arranged between the first and the secondof the ultrasonic element rows (SR1 and SR2 where k=1=i−1).Alternatively, the arrangement in FIG. 5 may be reversed in terms ofleft and right and the common electrode wiring (LC2) may be arrangedbetween the second and the third of the ultrasonic element rows (SR2 andSR3 where k=2=j).

According to this, it is possible to arrange the common electrode wiring(LC2), which supplies the common voltage to the i^(th) to the j^(th) ofthe ultrasonic element rows (SR2), between the k^(th) of the ultrasonicelement rows (for example, SR1) and the k+1^(th) of the ultrasonicelement rows (SR2). Due to this, it is possible to supply the commonvoltage with a low resistance with respect to the i^(th) to the j^(th)of the ultrasonic element rows (SR2) and it is possible to suppress areduction in voltage amplitude which is applied to the ultrasonicelements.

In addition, in the present embodiment, the substrate 60 where theultrasonic element array 100 is arranged and the common electrode wiring(LC2) is formed and the signal electrode wiring (LS2) which is formed onthe substrate 60 and performs at least one of supplying and receiving ofsignals with respect to the ultrasonic element rows (for example, SR2)are included. Each of the ultrasonic elements in the plurality ofultrasonic elements 10 has the first electrode (for example, the portionwhere the first electrode layer 21 covers the piezoelectric body layer30), the second electrode (for example, the second electrode layer 22 atthe portion which is covered by the piezoelectric body layer 30), andthe transducer section (for example, the piezoelectric body layer 30)which is provided between the first electrode and the second electrode.The first electrode may be connected to the signal electrode wiring (forexample, LS2), and the second electrode may be connected to the commonelectrode wiring (LC2).

For example, in the present embodiment, the common electrode wirings andthe signal electrode wirings are formed to extend on the substrate 60.Formed to extend refers to a conductive layer (a wiring layer) beinglaminated on the substrate 60 using, for example, an MEMS process, asemiconductor process, or the like and at least two points (for example,from the ultrasonic element to the signal terminal) being connectedusing the conductive layer.

In a case where the common electrode wiring (LC2) is formed on thesubstrate 60, there is a possibility that wiring resistance will begenerated in the common electrode wiring (LC2), but according to thepresent embodiment, it is possible to connect from the common terminal(CA2) to the ultrasonic element 10 with low resistance even in a casesuch as this and it is possible to suppress a reduction in voltageamplitude which is applied to the ultrasonic element 10.

In addition, in the present embodiment, the ultrasonic transducer device200 includes the plurality of signal electrode wirings LS1 to LS64, thefirst common electrode wiring (LC2) as the common electrode wiring (LC2)described above, and the second and third common electrode wirings (forexample, LC3 and LC4). Each of the signal electrode wirings of theplurality of signal electrode wirings LS1 to LS64 is arranged in thefirst direction D1. In addition, each of the signal electrode wiringsperforms at least one of supplying and receiving of signals with respectto any of the plurality of the ultrasonic element rows SR1 to SR64 whichare at least the first and the second of the ultrasonic element rows.Each of the common electrode wirings of the first to the third commonelectrode wirings (LC2 to LC4) is arranged in the first direction D1 andsupplies the common voltage with respect to one or a plurality of theultrasonic element rows out of the plurality of the ultrasonic elementrows SR1 to SR64.

According to this, at least the first common electrode wiring (forexample, LC2 in FIG. 5) is arranged between the ultrasonic element rowsand it is possible to supply the common voltage to each of one or aplurality of the ultrasonic element rows (for example, each of SR2 toSR4 in FIG. 5) using the first to the third common electrode wirings(LC2 to LC4). Due to this, it is possible to suppress a reduction involtage amplitude which is applied to the ultrasonic elements since itis possible for wiring resistance from the common electrode to theultrasonic terminal to be smaller.

In addition, in the present embodiment, the first common electrodewiring (for example, LC2 in FIG. 5) is electrically connected to the1^(st) to a p^(th) (where p is a natural number) of the ultrasonicelement rows (SR2) and is electrically not connected to the p+1^(th) toa q^(th) (where q is a natural number such that q>p) of the ultrasonicelement rows (SR3). The second common electrode wiring (LC3) iselectrically connected to the p+1^(th) to the q^(th) of the ultrasonicelement rows (SR3) and is electrically not connected to the 1^(st) tothe p^(th) of the ultrasonic element rows (SR2).

According to this, it is possible to suppress crosstalk between theultrasonic element rows via variation in voltage in the common electrodesince it is possible to separate the common electrode wiring (LC2) whichis connected to the 1^(st) to the p^(th) of the ultrasonic element rows(SR2) and the common electrode wiring (LC3) which is connected to thep+1^(th) to the q^(th) of the ultrasonic element rows (SR3). Forexample, the 1^(st) to the p^(th) of the ultrasonic element rows (SR2)for a continuous wave Doppler effect are set for receiving and thep+1^(th) to the q^(th) of the ultrasonic element rows (SR3) are set fortransmitting. Assuming that the common electrode wirings are shared, thecommon voltage would vary due to the driving signal, this variationwould have an effect on the ultrasonic element rows for receiving, andit would not be possible to detect a weak reception signal. In thispoint, it is possible to detect a weak reception signal according to thepresent embodiment since the common voltage for the ultrasonic elementrows for receiving is independent.

In addition, in the present embodiment, the ultrasonic transducer device200 includes the first and second common terminals (CA2 and CA3) whichare connected to the first and second common electrode wirings (forexample, LC2 and LC3 in FIG. 8), the first signal terminal (XA2) whichis connected together (in common) with the 1^(st) to an r^(th) (where ris a natural number) of the signal electrode wirings (LS3 and LS4), andthe second signal terminal (XA3) which is connected together (in common)with a k+1^(th) to a 2 k^(th) of the signal electrode wirings (LS5 andLS6). The first common electrode wiring (LC2) and the 1^(st) to thek^(th) of the signal electrode wirings (LS3 and LS4) are electricallyconnected to the 1^(st) to the k^(th) of the ultrasonic element rows(SR3 and SR4). The second common electrode wiring (LC3) and the k+1^(th)to the 2 k^(th) of the signal electrode wirings (LS5 and LS6) areelectrically connected to the k+1^(th) to the 2 k^(th) of the ultrasonicelement rows (SR5 and SR6).

According to this, it is possible to suppress crosstalk between channelsvia variation in voltage in the common electrode wirings since it ispossible to separate the common electrode wirings for each channel whichperforms at least transmitting and receiving of the same signal. Forexample, it is possible to allocate channels for reception and channelsfor transmission in a case where a continuous wave Doppler effectdescribed above is used.

In addition, in the present embodiment, the common electrode wiring (forexample, LC1 or the like) is formed on the substrate 60 so that adifference between the potential of the common electrode in the firstultrasonic element 10, which is arranged at a corner of the ultrasonicelement array 100, and the potential of the common electrode of thesecond ultrasonic element 10, which is arranged at the center of theultrasonic element array 100, is not generated.

Here, “so that a difference in potential is not generated” refers to,for example, the difference in potential being within a specific range.The specific range is a difference in potential between the commonelectrodes at the corner and the center of the ultrasonic element array100 where it is possible for a desired ultrasonic beam shape to berealized. For example, the voltage amplitude which is to be appliedbetween the electrodes in the ultrasonic elements is determined so as torealize the desired ultrasonic beam shape and a permissible error in thecommon voltage is determined so as to realize this voltage amplitude.Then, the common electrode wiring (for example, LC1 or the like) isformed so that the permissible error is in the range.

According to this, it is possible to not generate a difference betweenthe potential of the common voltage which is supplied to an end sectionof the ultrasonic element array 100 and the common voltage which issupplied to the central section of the ultrasonic element array 100. Dueto this, it is possible to suppress a reduction in driving voltageamplitude at the central section of the ultrasonic element array 100since variation in the common voltage due to wiring resistance asdescribed in FIG. 3 is small.

4. Detailed Configuration of Ultrasonic Transducer Device

FIGS. 9A to 9C illustrate a first detailed configuration example of theultrasonic transducer device 200. FIG. 9A is a plan view diagram with aplan view of the substrate 60, FIG. 9B is a cross sectional diagram atan AA′ cross section of FIG. 9A, and FIG. 9C is a cross sectionaldiagram at a BB′ cross section of FIG. 9A.

The ultrasonic transducer device 200 includes the substrate 60, thevibrating film 50, the piezoelectric body layer 30, first electrodelayers 21 a and 21 b, and a second electrode layer 22 a. Below, “above”represents a direction which is separated from the substrate 60 in anultrasonic wave emission direction and “below” represents a direction ofbeing closer to the substrate 60 in the opposite direction to theultrasonic wave emission direction.

The first electrode layer 21 a is formed above the vibrating film 50 ina line shape along the first direction D1 (the slice direction). Thesecond electrode layer 22 a is configured by an electrode layer LCd1which is formed above the first electrode layer 21 a in a line shapealong the first direction D1 and an electrode layer LCd2 which extendsfrom the electrode layer LCd1 in the second direction D2 (the scanningdirection). The electrode layer LCd2 is formed so as to cover an uppersection of the piezoelectric body layer 30. The electrode layer LCd1corresponds to one out of the signal electrode wiring and the commonelectrode wiring. The electrode layer LCd2 is also used as the upperelectrode of the ultrasonic element, and for example, a portion whichoverlaps with the piezoelectric body layer 30 in the plan view in FIG.9A is equivalent to the upper electrode.

The first electrode layer 21 b is formed above the vibrating film 50 ina line shape along the first direction D1. The piezoelectric body layer30 is provided above the opening 40 and the first electrode layer 21 bis formed between the piezoelectric body layer 30 and the vibrating film50. The first electrode layer 21 b corresponds to the other out of thesignal electrode wiring and the common electrode wiring. In addition,the first electrode layer 21 b is also used as the lower electrode ofthe ultrasonic element, and for example, a portion which overlaps withthe piezoelectric body layer 30 in the plan view in FIG. 9A isequivalent to the lower electrode.

In the embodiment above, the signal electrode wiring (the firstelectrode layer 21 b) is arranged in the first direction D1 to include aposition which overlaps with the piezoelectric body layer 30 (thetransducer section in a broad meaning) in a plan view with respect tothe ultrasonic element array 100. The common electrode wiring (theelectrode layer LCd1) is arranged in the first direction D1 at aposition which does not overlap with the piezoelectric body layer 30 ina plan view with respect to the ultrasonic element array 100.

According to this, it is possible to narrow the element pitch in thescanning direction (the second direction D2) since it is possible toarrange the first electrode layer 21 b below the piezoelectric bodylayer 30. Due to this, it is possible to suppress grating lobes in thescanning direction.

FIGS. 10A to 10C illustrate a second detailed configuration example ofthe ultrasonic transducer device 200. FIG. 10A is a plan view diagramwith a plan view of the substrate 60, FIG. 10B is a cross sectionaldiagram at an AA′ cross section of FIG. 10A, and FIG. 10C is a crosssectional diagram at a BB′ cross section of FIG. 10A.

The ultrasonic transducer device 200 includes the substrate 60, thevibrating film 50, the piezoelectric body layer 30, the first electrodelayers 21 a and 21 b, and second electrode layers 22 a and 22 b.

The configurations of the first electrode layer 21 a and the secondelectrode layer 22 a are the same as the first detail configurationexample, and thus the descriptions thereof are omitted.

The first electrode layer 21 b is configured by electrode layers LSd11and LSd12 which are formed above the vibrating film 50 in a line shapealong the first direction D1 and an electrode layer LSd2 which isconnected with the electrode layer LSd12 by extending from the electrodelayer LSd11 in the second direction D2. The electrode layer LSd12corresponds to the other out of the signal electrode wiring and thecommon electrode wiring. In addition, the electrode layer LSd11 is alsoused as the lower electrode of the ultrasonic element, and for example,a portion which overlaps with the piezoelectric body layer 30 in theplan view in FIG. 1 OA is equivalent to the lower electrode. The secondelectrode layer 22 b is formed above the first electrode layer 21 b soas to cover the first electrode layer 21 b.

In the embodiment above, the signal electrode wiring (the electrodelayer LSd12) is arranged in the first direction D1 at a position whichdoes not overlap with the piezoelectric body layer 30 in a plan viewwith respect to the ultrasonic element array 100. The common electrodewiring (the electrode layer LCd1) is arranged in the first direction D1at a position which does not overlap with the piezoelectric body layer30 and the signal electrode wiring (the electrode layer LSd12) in a planview with respect to the ultrasonic element array 100.

In this manner, the width of the electrode layer LSd12 is determinedwithout limiting the width of the piezoelectric body layer 30 and it ispossible to reduce wiring impedance in the signal electrode wirings byproviding the electrode layer LSd12 separately to the electrode layerLSd11 which is provided below the piezoelectric body layer 30. Due tothis, it is possible to supply the common voltage (and the drivingsignal) to the ultrasonic elements with even lower impedance.

5. Ultrasonic Measurement Apparatus

FIG. 11 illustrates a configuration example of the ultrasonicmeasurement apparatus where the ultrasonic transducer device 200 isapplied. A case will be described below where an integrated circuitdevice which includes a transmission circuit is mounted on a flexiblesubstrate, but the present embodiment is not limited to this and thetransmission circuit may be provided on a rigid substrate in a probe.

The ultrasonic measurement apparatus includes the ultrasonic transducerdevice 200 (an element chip), a first flexible substrate 130, a secondflexible substrate 140, a first integrated circuit device 110, and asecond integrated circuit device 120. Here, the ultrasonic transducerdevice is also referred to as the element chip below.

As shown in FIG. 11, a direction above the flexible substrate 130 is athird direction D3 and a direction which intersects with (for example,is orthogonal to) the third direction D3 is a fourth direction D4. Theflexible substrate 130 is connected with the element chip 200 at one endsection HFA1 in the third direction D3 and is connected to a rigidsubstrate in a probe at the other end section HFA2 via, for example, aconnector or the like which is not shown in the diagram. The integratedcircuit device 110 is mounted to the flexible substrate 130 so that thelong-side direction is along the fourth direction D4.

In detail, 1^(st) to 64^(th) signal wirings LXA1 to LXA64 and 1^(st) to64^(th) common wirings LCA1 to LCA64 are arranged on the flexiblesubstrate 130 along the third direction D3. One out of the ends of the1^(st) to 64^(th) signal wirings LXA1 to LXA64 are connected with the1^(5t) to 64^(th) signal terminals XA1 to XA64 of the element chip 200,and one out of the ends of the 1^(st) to 64^(th) common wirings LCA1 toLCA64 are connected with the 1^(st) to 64^(th) common terminals CA1 toCA64 of the element chip 200. The 1^(st) to 64^(th) signal terminals XA1to XA64 and the 1^(st) to 64^(th) common terminals CA1 to CA64 areformed on a surface on an ultrasonic wave emission direction side of theelement chip 200 and the flexible substrate 130 is connected with theelement chip 200 at the surface on the ultrasonic wave emissiondirection side.

The integrated circuit device 110 includes 1^(st) to 64^(th)transmission circuits (for example, TXA1 to TXA64 in FIG. 12) whichoutput driving signals and 1^(st) to 64^(th) transmission terminals(which are not shown in the diagram) which are connected to output nodesof the 1^(st) to 64^(th) transmission circuits. The 1^(st) to 64^(th)transmission terminals are arranged along a first long side HLA1 of theintegrated circuit device 110 and are respectively connected with the1^(st) to 64^(th) signal wirings LXA1 to LXA64.

A common voltage output circuit which is not shown in the diagram isprovided in the rigid substrate in the probe to supply the commonvoltage with respect to the 1^(st) to 64^(th) common terminals CA1 toCA64 of the element chip 200 via the 1^(st) to 64^(th) common wiringsLCA1 to LCA64. The 1^(st) to 64^(th) transmissions circuits in theintegrated circuit device 110 supply driving signals with respect to the1^(st) to 64^(th) signal terminals XA1 to XA64 in the element chip 200via the 1^(st) to 64^(th) signal wirings LXA1 to LXA64 and an ultrasonicbeam is output from the element chip 200. When the element chip 200receives an ultrasonic echo, a reception signal is output from the1^(st) to 64^(th) signal terminals XA1 to XA64. A reception circuitwhich is not shown in the diagram is provided in the rigid substrate inthe probe to receive the reception signal via the 1^(st) to 64^(th)signal wirings LXA1 to LXA64.

A plurality of control signal wirings CTLA1 to CTLA4 may be arranged inthe flexible substrate 130. A control signal is input from, for example,a control circuit (for example, a transmitting and receiving controlsection 334 in FIG. 16) which is provided in the rigid substrate in theprobe via the control signal wirings CTLA1 to CTLA4. For example, thecontrol circuit outputs a control signal which instructs outputting of adriving pulse signal with respect to the transmission circuit. Thecontrol signal is output with a timing according to a delay time (outputtiming) of the driving pulse signal and the transmission circuit outputsthe driving pulse signal at the timing of receiving the control signal.

The mounting of the integrated circuit device 110 is realized usingflip-chip mounting (bare chip mounting) which uses an anisotropicconductive film (ACF). Here, flip-chip mounting is face-down mountingwhere, for example, the element forming surface is mounted on theflexible substrate 130 side. Alternatively, flip-chip mounting may beface-up mounting where the rear surface of the element forming surfaceis mounted on the flexible substrate 130 side.

In this manner, it is possible to reduce the size of the probe comparedto a case where the transmission circuit is provided in the rigidsubstrate in the probe due to the integrated circuit device 110 whichincludes the transmission circuit being mounted on the flexiblesubstrate. In addition, by performing flip-chip mounting, it is possibleto reduce the mounting area compared to a case where the integratedcircuit device which is a flat package is mounted on the rigidsubstrate. In addition, it is possible to reduce the size of theintegrated circuit device 110 since it is possible for the element chip200 of the present embodiment to be driven using approximately 10 to 30V. As a result, it is possible to easily realize a reduction in sizeusing flip-chip mounting which is difficult with bulk piezoelectricelements which are necessary in integrated circuit devices with highresistance to voltage.

Here, 1^(st) to 64^(th) dummy terminals are provided along a second longside HLA2 of the integrated circuit device 110 and the 1^(st) to 64^(th)dummy terminals may be connected to the 1^(st) to 64^(th) signal wiringsLXA1 to LXA64. According to this, the force of hardening shrinkagebecomes uniform at the first long side HLA1 side and the second longside HLA2 side when the terminals are conductive with the wiring due tohardening shrinkage of the anisotropic conductive film and it ispossible to improve reliability of the conductivity.

It is possible to configure the second flexible substrate 140 and thesecond integrated circuit device 120 in the same manner as the firstflexible substrate 130 and the first integrated circuit device 110. Thatis, 1^(st) to 64^(th) signal wirings LXB1 to LXB64 and 1^(st) to 64^(th)common wirings LCB1 to LCB64 are arranged on the flexible substrate 140along a fifth direction D5. One out of the ends of the 1^(st) to 64^(th)signal wirings LXB1 to LXB64 are connected with the 1^(st) to 64^(th)signal terminals XB1 to XB64 of the element chip 200, and one out of theends of the 1^(st) to 64^(th) common wirings LCB1 to LCB64 are connectedwith the 1^(st) to 64^(th) common terminals CB1 to CB64 of the elementchip 200. The integrated circuit device 120 is flip-chip mounted on theflexible substrate 140 so that the long-side direction is along a sixthdirection D6 which intersects with (for example, is orthogonal with) thefifth direction D5.

Here, a case is described in the description above where the integratedcircuit devices 110 and 120 include the transmission circuits, but thepresent invention is not limited to this, and for example, theintegrated circuit devices 110 and 120 may further include atransmission and reception switching circuit (or a limiter circuit), amultiplexer, a reception circuit, or the like.

6. Layout Configuration Example of Integrated Circuit Device

FIG. 12 illustrates a layout configuration example of the firstintegrated circuit device 110 and the second integrated circuit device120. Here, for simplicity, the common terminals CA1 to CA64 and CB1 toCB64 and the common wirings LCA1 to LCA64 and LCB1 to LCB64 are omittedfrom the diagram.

The integrated circuit device 110 includes the 1^(st) to 64^(th)transmission circuits TXA1 to TXA64 which are arranged along the fourthdirection D4 (the long-side direction of the integrated circuit device110), a first control circuit CTA1 which is arranged on a first shortside HSA1 side, and a second control circuit CTA2 which is arranged on asecond short side HSA2 side.

The 1^(st) to 64^(th) transmission circuits TXA1 to TXA64 are configuredfrom pulsars which output driving pulse signals. The control circuitsCTA1 and CTA2 are logic circuits which output control signals to thetransmission circuits TXA1 to TXA64 by receiving control signals fromthe control circuit of the rigid substrate. Here, only one of thecontrol circuits CTA1 and CTA2 may be included or the control circuitsCTA1 and CTA2 may be omitted.

It is possible for the integrated circuit device 120 to be configured inthe same manner as the integrated circuit device 110. That is, theintegrated circuit device 120 includes 1^(st) to 64^(th) transmissioncircuits TXB1 to TXB64 which are arranged along the sixth direction D6(the long-side direction of the integrated circuit device 120), a firstcontrol circuit CTB1 which is arranged on a first short side HSB1 side,and a second control circuit CTB2 which is arranged on a second shortside HSB2 side.

According to the present layout configuration example, it is possiblefor the integrated circuit devices 110 and 120 to be configured in along and narrow rectangular shape in the long-side direction and for thetransmission circuits TXA1 to TXA64 and TXB1 to TXB64 to oppose thesignal terminals XA1 to XA64 and XB1 to XB64 in the element chip 200.Due to this, it is possible for the wiring between the terminals to besimplified and for the integrated circuit devices 110 and 120 to bemounted in a compact manner with respect to the flexible substrates 130and 140.

7. Head Unit

FIG. 13 illustrates a configuration example of a head unit 220 which ismounted in the ultrasonic measurement apparatus of the presentembodiment. The head unit 220 shown in FIG. 13 includes the element chip200, a connecting section 210, and a supporting member 250. Here, thehead unit 220 of the present embodiment is not limited to theconfiguration in FIG. 13 and various modifications are possible such asa portion of the constituent elements being omitted or being replacedwith other constituent elements or other constituent elements beingadded.

The element chip 200 includes the ultrasonic element array 100, a firstchip element group (the one end side signal terminals XA1 to XA64 andthe one end side common terminals CA1 to CA64), and a second chipelement group (the other end side signal terminals XB1 to XB64 and theother end side common terminals CB1 to CB64). The element chip 200 iselectrically connected to a processing apparatus (for example, aprocessing apparatus 330 in FIG. 16) which has a probe body via theconnecting section 210.

The connecting section 210 electrically connects the probe body and thehead unit 220 and has connectors which have a plurality of connectionterminals and a flexible substrate which is formed with wiring whichconnects the connector and the element chip 200. In detail, theconnecting section 210 has a first connector 421 and a second connector422 as the connectors and has the first flexible substrate 130 and thesecond flexible substrate 140 as the flexible substrate.

A first wiring group (a plurality of signal wirings and a plurality ofcommon wirings) which connect the first chip terminal group (XA1 to XA64and CA1 to CA64), which are provided on a first side of the element chip200, and a terminal group of the connector 421 is formed on the firstflexible substrate 130. A second wiring group (a plurality of signalwirings and a plurality of common wirings) which connects the secondchip terminal group (XB1 to XB64 and CB1 to CB64), which are provided ona second side of the element chip 200, and a terminal group of theconnector 422 is formed on the second flexible substrate 140.

Here, the connecting section 210 is not limited to the configurationshown in FIG. 13, and for example, the connecting section 210 may beconfigured to not include the connectors 421 and 422 and may be providedwith a connection terminal group instead of the connectors 421 and 422.

As above, it is possible to electrically connect the probe body and thehead unit 220 by providing the connecting section 210 and it is alsopossible for the head unit 220 to be attached to and detached from theprobe body.

FIG. 14A to FIG. 14C illustrate a detailed configuration example of thehead unit 220. FIG. 14A illustrates a second surface SF2 side of thesupporting member 250, FIG. 14B illustrates a first surface SF1 side ofthe supporting member 250, and FIG. 14C illustrates a side surface sideof the supporting member 250. Here, the head unit 220 of the presentembodiment is not limited to the configuration of FIG. 14A to FIG. 14Cand various modifications are possible such as a portion of theconstituent elements being omitted or being replaced with otherconstituent elements or other constituent elements being added.

The supporting member 250 is a member which supports the element chip200. The connectors 421 and 422 (a plurality of connection terminals ina broad meaning) are provided on the first surface SF1 side of thesupporting member 250. It is possible for the connectors 421 and 422 tobe attached to and detached from connectors which correspond to theprobe body side. The element chip 200 is supported on the second surfaceSF2 side which is the rear surface of the first surface SF1 of thesupporting member 250. Fixing members 260 are provided at each cornersection of the supporting member 250 and are used to fix the head unit220 to a probe casing.

Here, the first surface SF1 side of the supporting member 250 is anormal direction side of the first surface SF1 of the supporting member250, and the second surface SF2 side of the supporting member 250 is anormal direction side of the second surface SF2 which is the rearsurface of the first surface SF1 of the supporting member 250.

As shown in FIG. 14C, a protective member (a protecting film) 270 whichprotects the element chip 200 is provided on the surface (the surfacewhere the piezoelectric body layer 30 is formed in FIG. 1B) of theelement chip 200. The protective member may also be used as an acousticadjustment layer.

8. Ultrasonic Probe

FIG. 15A and FIG. 15B illustrate a configuration example of anultrasonic probe 300 (a probe) where the head unit 220 described aboveis applied. FIG. 15A illustrates a case where a probe head 310 ismounted in a probe body 320 and FIG. 15B illustrates a case where theprobe head 310 is separated from the probe body 320.

The probe head 310 includes the head unit 220 and a probe casing 240which contains a contact member 230, which comes into contact with asubject, and the head unit 220. The element chip 200 is provided betweenthe contact member 230 and the supporting member 250.

The probe body 320 includes the processing apparatus 330 and a probebody side connector 426. The processing apparatus 330 includes atransmission section 332, a reception section 335 (an analog front endsection), and the transmission and reception control section 334. Thetransmission section 332 performs a process of transmitting a drivingpulse (a transmission signal) to the element chip 200. The receptionsection 335 performs a process of receiving an ultrasonic echo signal (areception signal) from the element chip 200. The transmission andreception control section 334 performs control of the transmissionsection 332 and the reception section 335. The probe body side connector426 connects with a head unit (or probe head) side connector 425. Theprobe body 320 connects with an electronic device (for example, anultrasonic imaging apparatus) body using a cable 350.

The head unit 220 is contained in the probe casing 240, but it ispossible to remove the head unit 220 from the probe casing 240. By doingthis, it is possible to replace only the head unit 220. Alternatively,it is possible to replace the head unit 220 in a state of beingcontained in the probe casing 240, that is, as the probe head 310.

9. Ultrasonic Imaging Apparatus

FIG. 16 illustrates a configuration example of an ultrasonic imagingapparatus. The ultrasonic imaging apparatus includes the ultrasonicprobe 300 and an electronic device body 400. The ultrasonic probe 300includes the head unit 220 (an ultrasonic head unit) and the processingapparatus 330. The electronic device body 400 includes a control section410, a processing section 420, a user interface section 430, and adisplay section 440.

The processing apparatus 330 includes the transmission section 332, thetransmission and reception control section 334, and the receptionsection 335 (an analog front end section). The head unit 220 includesthe element chip 200 and the connecting section 210 (a connectorsection) which connects the element chip 200 with a circuit substrate(for example, a rigid substrate). The transmission section 332, thetransmission and reception control section 334, and the receptionsection 335 are mounted on the circuit substrate. The transmissionsection 332 may include a high voltage generating circuit (for example,a booster circuit) which generates a power supply voltage of a pulsar.

In a case where ultrasonic waves are transmitted, the transmission andreception control section 334 performs a transmission instruction withrespect to the transmission section 332, and the transmission section332 receives the transmission instruction and outputs a driving voltageby amplifying a driving signal to a high voltage. In a case wherereflected ultrasonic waves are received, the reception section 335receives a reflected wave signal which is detected using the elementchip 200. The reception section 335 processes the reflected wave signal(for example, an amplification process, an A/D conversion process, orthe like) based on a reception instruction from the transmission andreception control section 334 and the signal after processing istransmitted to the processing section 420. The processing section 420displays the signal on the display section 440 as an image.

Here, it is possible for the ultrasonic transducer device of the presentembodiment to be applied to various electronic devices without beinglimited to the ultrasonic imaging apparatus for medical use as describedabove. For example, a diagnosis device for checking the insides ofbuildings and the like without damage, a user interface device whichdetects movement of a finger of a user using reflection of ultrasonicwaves, and the like can be assumed as the electronic devices where theultrasonic transducer device is applied.

Here, the present embodiment is described in detail as above, but itshould be possible for a person skilled in the art to easily conceivethat many changes are possible without substantially departing from thenovel items and effects of the present invention. In accordance withthis, all of the modified examples are included in the scope of thepresent invention. For example, in the specifications and diagrams, itis possible for terms, which are described along with different termswhich have a broader or similar meaning, to be replaced at least oncewith the different terms in any locations in any of the specificationsor diagrams. In addition, all combinations of the embodiments andmodified examples are also included in the scope of the presentinvention. In addition, various modifications are possible with respectto the configuration and operation of the integrated circuit, theultrasonic element, the ultrasonic transducer device, the ultrasonicmeasurement apparatus, the ultrasonic head unit, the ultrasonic probe,and the ultrasonic imaging apparatus, the method for mounting theintegrated circuit device, and the like without being limited to what isdescribed in the embodiments.

An ultrasonic transducer device according to one aspect includes anultrasonic element array and a common electrode wiring. The ultrasonicelement array has three ultrasonic element rows with each of the threeultrasonic element rows including a plurality of ultrasonic elementsarranged along a first direction and electrically connected to eachother. The three ultrasonic element rows are arranged along a seconddirection intersecting with the first direction. The common electrodewiring is configured and arranged to supply a common voltage to at leastone of the three ultrasonic element rows. The common electrode wiringextends in the first direction and is arranged between two of the threeultrasonic element rows positioned on outer sides among the threeultrasonic element rows with respect to the second direction.

According to this aspect, the common electrode wiring which supplies thecommon voltage to the one row of the ultrasonic element rows out of thethree rows of the ultrasonic element rows is arranged between two rowsof the ultrasonic element rows which are positioned on the outer sidesout of the three rows of the ultrasonic element rows. Due to this, it ispossible to suppress a reduction in voltage amplitude which is appliedto the ultrasonic elements.

In addition, in another aspect, the ultrasonic element array preferablyhas a 1^(st) to an n^(th) ultrasonic element rows (where n is an integerof three or more) including the three ultrasonic element rows with the1^(st) to the n^(th) ultrasonic element rows being arranged along thesecond direction, and the common electrode wiring is preferablyconfigured and arranged to supply the common voltage to an i^(th) to aj^(th) ultrasonic element rows (where i and j are natural numbers suchthat i≦j≦n−1) among the 1^(st) to the n^(th) ultrasonic element rows,and is arranged between a k^(th) ultrasonic element row and a k+1^(th)ultrasonic element row (where k is a natural number such that i−1≦k≦j)among an i−1^(th) to the j^(th) ultrasonic element rows.

By doing so, it is possible to arrange the common electrode wiring,which supplies the common voltage to the i^(th) to the i^(th) of theultrasonic element rows, between the k^(th) of the ultrasonic elementrows and the k+1^(th) of the ultrasonic element rows out of the i−1^(th)to the j^(th) of the ultrasonic element rows. Due to this, it ispossible to supply the common voltage with a low resistance with respectto the i^(th) to the j^(th) of the ultrasonic element rows and it ispossible to suppress a reduction in voltage amplitude which is appliedto the ultrasonic elements.

In addition, in another aspect, the ultrasonic transducer devicepreferably further includes: a substrate on which the ultrasonic elementarray and the common electrode wiring are arranged; and a signalelectrode wiring disposed on the substrate and configured and arrangedto perform at least one of supplying and receiving of signals withrespect to at least one of the three ultrasonic element rows. Each ofthe ultrasonic elements in the at least one of the three ultrasonicelement rows preferably has a first electrode, a second electrode, and atransducer section arranged between the first electrode and the secondelectrode, with the first electrode being connected to the signalelectrode wiring, and the second electrode being connected to the commonelectrode wiring.

There is a possibility that wiring resistance may be generated in thecommon electrode wiring in a case where the common electrode wiring isformed on the substrate, but according to the aspect of the presentinvention, it is possible to supply the common voltage with lowresistance even in such a case and it is possible to suppress areduction in voltage amplitude which is applied to the ultrasonicelements.

In addition, in another aspect, the substrate preferably has a pluralityof openings arranged in an array formation. Each of the ultrasonicelements preferably has a vibrating film covering a corresponding one ofthe openings and a piezoelectric element section disposed on thevibrating film. The piezoelectric element section preferably has a lowerelectrode disposed on the vibrating film as one of the first electrodeand the second electrode, a piezoelectric body layer as the transducersection covering at least a portion of the lower electrode, and an upperelectrode as the other of the first electrode and the second electrodecovering at least a portion of the piezoelectric body layer.

By doing so, it is possible to configure the ultrasonic element arrayusing the ultrasonic elements where the vibrating films which block offthe openings vibrate due to the piezoelectric elements. Due to this, itis possible to drive the ultrasonic elements using a driving signal witha low voltage compared to a case where bulk piezoelectric elements areused and it is possible to form a transmission circuit in a compactmanner since it is possible to manufacture the transmission circuit in aprocess with a low resistance to voltage.

In addition, in another aspect, the ultrasonic transducer devicepreferably further includes: a plurality of signal electrode wirings; afirst common electrode wiring as the common electrode wiring; and atleast a second and a third common electrode wirings. The ultrasonicelement array preferably has a plurality of ultrasonic element rowsincluding the three ultrasonic element rows. Each of the signalelectrode wirings preferably extends in the first direction andconfigured and arranged to perform at least one of supplying andreceiving of signals with respect to at least one of the ultrasonicelement rows. Each of the first to third common electrode wiringspreferably extends in the first direction and configured and arranged tosupply the common voltage with respect to at least one of the ultrasonicelement rows.

By doing so, at least the first common electrode wiring is arrangedbetween the ultrasonic element rows and it is possible to supply thecommon voltage to each of one or a plurality of the ultrasonic elementrows using the first to the third common electrode wirings. Due to this,it is possible to suppress a reduction in voltage amplitude which isapplied to the ultrasonic elements since it is possible for wiringresistance from the common electrode wiring to the ultrasonic elementsto be smaller.

In addition, in another aspect, the first common electrode wiring ispreferably electrically connected to a 1^(st) to a p^(th) ultrasonicelement rows (where p is a natural number) among the ultrasonic elementrows and is electrically not connected to a p+1^(th) to a q^(th)ultrasonic element rows (where q is a natural number such that q>p)among the ultrasonic element rows. The second common electrode wiring ispreferably electrically connected to the p+1^(th) to the g^(th)ultrasonic element rows and electrically not connected to the 1^(st) tothe p^(th) ultrasonic element rows.

By doing so, it is possible to suppress crosstalk between the ultrasonicelement rows via variation in voltage in the common electrode wiringsince it is possible for the common electrode wiring which is connectedto the 1^(st) to the p^(th) of the ultrasonic element rows and thecommon electrode wiring which is connected to the p+1^(th) to the q^(th)of the ultrasonic element rows to be electrically not connected.

In addition, in another aspect, the ultrasonic transducer devicepreferably further includes: a first end signal terminal arranged at afirst end of the ultrasonic element array in the first direction and isconnected to a first end of at least one of the signal electrodewirings; and a second end signal terminal arranged at a second end ofthe ultrasonic element array in the first direction and is connected toa second end of the at least one of the signal electrode wirings.

In addition, in another aspect, the ultrasonic transducer devicepreferably further includes: a first end common terminal arranged at afirst end of the ultrasonic element array in the first direction and isconnected to a first end of at least one of the first to the thirdcommon electrode wirings; and a second end common terminal arranged at asecond end of the ultrasonic element array in the first direction and isconnected to a second end of the at least one of the first to thirdcommon electrode wirings.

According to these aspects, it is possible to have attenuation ofvoltage amplitude which is applied between the electrodes of theultrasonic elements be symmetrical from both ends of the ultrasonicelement rows toward the center since it is possible to supply thedriving signal and the common voltage from both ends of the ultrasonicelement rows. That is, it is possible to suppress a sound field frombecoming unsymmetrical with attenuation of voltage amplitude from thefirst end side of the ultrasonic element rows toward the second endside.

In addition, in another aspect, the ultrasonic transducer devicepreferably further includes: a first common terminal connected with thefirst common electrode wiring; a second common terminal connected withthe second common electrode wiring; a first signal terminal connected incommon with a 1^(st) to an r^(th) signal electrode wirings (where r is anatural number) among the signal electrode wirings; and a second signalterminal connected in common with a r+1^(th) to a 2 r^(th) signalelectrode wirings among the signal electrode wirings. The first commonelectrode wiring and the 1^(st) to the r^(th) signal electrode wiringsare preferably electrically connected to a 1^(st) to an r^(th)ultrasonic element rows among the ultrasonic element rows. The secondcommon electrode wiring and the r+1^(th) to the 2 r^(th) signalelectrode wirings are preferably electrically connected to an r+1^(th)to a 2 r^(th) ultrasonic element rows among the ultrasonic element rows.

By doing this, it is possible to suppress crosstalk between channels viavariation in voltage in the common electrode wirings since it ispossible to separate the common electrode wirings for each channel whichperforms at least one of transmitting and receiving of signals.

In addition, in another aspect, the signal electrode wiring preferablyextends in the first direction at a position overlapping with thetransducer section in a plan view with respect to the ultrasonic elementarrays, and the common electrode wiring preferably extends in the firstdirection at a position which does not overlap with the transducersection in the plan view.

By doing this, it is possible to narrow the pitch for arranging theultrasonic element rows in the second direction since it is possible toarrange the signal electrode wirings below the transducer section. Dueto this, it is possible to suppress grating lobes.

In addition, in another aspect, the signal electrode wiring preferablyextends in the first direction at a position which does not overlap withthe transducer section in a plan view with respect to the ultrasonicelement arrays, and the common electrode wiring preferably extends inthe first direction at a position which does not overlap with thetransducer section and the signal electrode wiring in the plan view.

By doing this, it is possible to determine the width of the signalelectrode wirings without limiting the width of the transducer sectionsince it is possible to provide the signal electrode wirings at aposition which does not overlap with the transducer section. Due tothis, it is possible to reduce wiring impedance in the signal electrodewirings.

An ultrasonic transducer device according to another aspect includes asubstrate, an ultrasonic element array, and a common electrode wiring.The ultrasonic element array is arranged in an array formation on thesubstrate. The ultrasonic element array includes a first ultrasonicelement arranged at a corner of the ultrasonic element array and asecond ultrasonic element arranged in a center portion of the ultrasonicelement array. The common electrode wiring is disposed on the substrateso that a potential of a common electrode in the first ultrasonicelement and a potential of a common electrode of the second ultrasonicelement are substantially the same.

By doing this, it is possible to configure an ultrasonic transducerdevice so as to not generate a difference between the common voltagewhich is supplied to the ultrasonic elements at the corner of theultrasonic element array, and the common voltage which is supplied tothe ultrasonic elements at the center of the ultrasonic element array.Due to this, it is possible to suppress a reduction in voltage amplitudewhich is applied between the electrodes in the ultrasonic elements at acentral section of the ultrasonic element array since disparity in thecommon voltage at the corner and the center of the ultrasonic elementarray is small.

In addition, in another aspect, the ultrasonic element array preferablyhas three ultrasonic element rows with each of the three ultrasonicelement rows including a plurality of ultrasonic elements arranged alonga first direction and electrically connected to each other, the threeultrasonic element rows being arranged along a second directionintersecting with the first direction. The common electrode wiring ispreferably configured and arranged to supply a common voltage to one ofthe three ultrasonic element rows, the common electrode wiring extendingin the first direction and being arranged between two of the threeultrasonic element rows positioned on outer sides among the threeultrasonic element rows with respect to the second direction.

In addition, an ultrasonic measurement apparatus according to anotheraspect includes an ultrasonic transducer device, a first flexiblesubstrate and a second flexible substrate. The ultrasonic transducerdevice includes: an ultrasonic element array having three ultrasonicelement rows with each of the three ultrasonic element rows including aplurality of ultrasonic elements arranged along a first direction andelectrically connected to each other, the three ultrasonic element rowsbeing arranged along a second direction intersecting with the firstdirection; and a common electrode wiring configured and arranged tosupply a common voltage to at least one of the three ultrasonic elementrows, the common electrode wiring extending in the first direction andbeing arranged between two of the three ultrasonic element rowspositioned on outer sides among the three ultrasonic element rows withrespect to the second direction; a substrate on which the ultrasonicelement array and the common electrode wiring are arranged; and threesignal electrode wirings disposed on the substrate and configured andarranged to perform at least one of supplying and receiving of signalswith respect to corresponding ones of the three ultrasonic element rows.The first flexible substrate includes a plurality of first signalwirings. The second flexible wiring includes a plurality of secondsignal wirings. Three of the first signal wirings are respectivelyconnected to first ends of the three signal electrode wirings. Three ofthe second signal wirings are respectively connected to second ends ofthe three signal electrode wirings.

In addition, in another aspect, the ultrasonic measurement apparatuspreferably further includes: a first integrated circuit device mountedon the first flexible substrate and has a plurality of firsttransmission circuits; and a second integrated circuit device mounted onthe second flexible substrate and has a plurality of second transmissioncircuits. Each of the first transmission circuits is configured andarranged to output a transmission signal to a corresponding one of thefirst signal wirings. Each of the second transmission circuits isconfigured and arranged to output a transmission signal to acorresponding one of the second signal wirings.

In addition, a head unit of a probe according to another aspect includesthe ultrasonic transducer device according to any one of the abovedescribed aspects. The ultrasonic transducer device is configured andarranged to be attached and detached with respect to a probe body of theprobe.

In addition, a probe according to another aspect includes: theultrasonic transducer device according to any one of the above describedaspects; and a probe body.

In addition, an ultrasonic imaging apparatus according to another aspectincludes: the ultrasonic transducer device according to any one of theabove described aspects; and a display section configured and arrangedto display image data.

GENERAL INTERPRETATION OF TERMS

In understanding the scope of the present invention, the term“comprising” and its derivatives, as used herein, are intended to beopen ended terms that specify the presence of the stated features,elements, components, groups, integers, and/or steps, but do not excludethe presence of other unstated features, elements, components, groups,integers and/or steps. The foregoing also applies to words havingsimilar meanings such as the terms, “including”, “having” and theirderivatives. Also, the terms “part,” “section,” “portion,” “member” or“element” when used in the singular can have the dual meaning of asingle part or a plurality of parts. Finally, terms of degree such as“substantially”, “about” and “approximately” as used herein mean areasonable amount of deviation of the modified term such that the endresult is not significantly changed. For example, these terms can beconstrued as including a deviation of at least ±5% of the modified termif this deviation would not negate the meaning of the word it modifies.

While only selected embodiments have been chosen to illustrate thepresent invention, it will be apparent to those skilled in the art fromthis disclosure that various changes and modifications can be madeherein without departing from the scope of the invention as defined inthe appended claims. Furthermore, the foregoing descriptions of theembodiments according to the present invention are provided forillustration only, and not for the purpose of limiting the invention asdefined by the appended claims and their equivalents.

What is claimed is:
 1. An ultrasonic transducer device comprising: asubstrate; an ultrasonic element array having a plurality of ultrasonicelement rows each including a plurality of ultrasonic elements arrangedalong a first direction and electrically connected to each other, theplurality of ultrasonic element rows being arranged along a seconddirection intersecting with the first direction; and a plurality ofcommon electrode wirings each configured to independently supply acommon voltage to at least one of the ultrasonic element rows, thecommon electrode wirings extending along the first direction, one of thecommon electrode wirings being arranged between a pair of the ultrasonicelement rows with respect to the second direction, the common electrodewirings being non-overlapped with the ultrasonic elements as viewed in athickness direction of the substrate that is a normal direction of asurface of the substrate over which the ultrasonic element array isdisposed.
 2. The ultrasonic transducer device according to claim 1,wherein the ultrasonic element array has a 1^(st) to an n^(th)ultrasonic element rows, where n is an integer of three or more,including the ultrasonic element rows with the 1^(st) to the n^(th)ultrasonic element rows being arranged along the second direction, andthe one of the common electrode wirings is configured to supply thecommon voltage to an i^(th) to a j^(th) ultrasonic element rows, where iand j are natural numbers such that i≦j≦n−1, among the 1^(st) to then^(th) ultrasonic element rows, and is arranged between a k^(th)ultrasonic element row and a k+1^(th) ultrasonic element row, where k isa natural number such that i−1≦k≦j, among an i−1^(th) to the j^(th)ultrasonic element rows.
 3. The ultrasonic transducer device accordingto claim 1, further comprising: a plurality of signal electrode wiringsconfigured to supply or receive signals with respect to the ultrasonicelement rows, wherein each of the ultrasonic elements in the ultrasonicelement rows has a first electrode, a second electrode, and a transducersection arranged between the first electrode and the second electrode,with the first electrode being connected to corresponding one of thesignal electrode wirings, and the second electrode being connected tocorresponding one of the common electrode wirings.
 4. The ultrasonictransducer device according to claim 3, wherein the substrate has aplurality of openings arranged in an array formation, each of theultrasonic elements has a vibrating film covering a corresponding one ofthe openings and a piezoelectric element section disposed on thevibrating film, and the piezoelectric element section has a lowerelectrode disposed on the vibrating film as one of the first electrodeand the second electrode, a piezoelectric body layer as the transducersection covering at least a portion of the lower electrode, and an upperelectrode as the other of the first electrode and the second electrodecovering at least a portion of the piezoelectric body layer.
 5. Theultrasonic transducer device according to claim 1, further comprising: aplurality of signal electrode wirings; wherein the common electrodewirings includes first, second and third common electrode wirings, eachof the signal electrode wirings extends in the first direction andconfigured to supply or receive signals with respect to at least one ofthe ultrasonic element rows, and each of the first, second and thirdcommon electrode wirings extends in the first direction and configuredto supply the common voltage with respect to the ultrasonic elementrows.
 6. The ultrasonic transducer device according to claim 5, whereinthe first common electrode wiring is electrically connected to a 1^(st)to p^(th) ultrasonic element rows, where p is a natural number, amongthe ultrasonic element rows and is electrically not connected to ap+1^(th) to a q^(th) ultrasonic element rows, where q is a naturalnumber such that q>p, among the ultrasonic element rows, and the secondcommon electrode wiring is electrically connected to the p+1^(th) to theq^(th) ultrasonic element rows and electrically not connected to the1^(st) to the p^(th) ultrasonic element rows.
 7. The ultrasonictransducer device according to claim 5, further comprising: a first endsignal terminal arranged at a first end of the ultrasonic element arraywith respect to the first direction and is connected to a first end ofat least one of the signal electrode wirings; and a second end signalterminal arranged at a second end of the ultrasonic element array withrespect to the first direction and is connected to a second end of theat least one of the signal electrode wirings.
 8. The ultrasonictransducer device according to claim 5, further comprising: a first endcommon terminal arranged at a first end of the ultrasonic element arraywith respect to the first direction and is connected to a first end ofat least one of the first to the third common electrode wirings; and asecond end common terminal arranged at a second end of the ultrasonicelement array with respect to the first direction and is connected to asecond end of the at least one of the first to the third commonelectrode wirings.
 9. The ultrasonic transducer device according toclaim 5, further comprising: a first common terminal connected with thefirst common electrode wiring; a second common terminal connected withthe second common electrode wiring; a first signal terminal connected incommon with a 1^(st) to an r^(th) signal electrode wirings, where r is anatural number, among the signal electrode wirings; and a second signalterminal connected in common with a r+1^(th) to a 2 r^(th) signalelectrode wirings among the signal electrode wirings, wherein the firstcommon electrode wiring and the 1^(st) to the r^(th) signal electrodewirings are electrically connected to a 1^(st) to an r^(th) ultrasonicelement rows among the ultrasonic element rows, and the second commonelectrode wiring and the r+1^(th) to the 2 r^(th) signal electrodewirings are electrically connected to an r+1^(th) to a 2 r^(th)ultrasonic element rows among the ultrasonic element rows.
 10. Theultrasonic transducer device according to claim 3, wherein the signalelectrode wirings each extend in the first direction at a positionoverlapping with the transducer section in a plan view with respect tothe ultrasonic element array, and the common electrode wirings eachextend in the first direction at a position which does not overlap withthe transducer section in the plan view.
 11. The ultrasonic transducerdevice according to claim 3, wherein the signal electrode wirings eachextend in the first direction at a position which does not overlap withthe transducer section in a plan view with respect to the ultrasonicelement array, and the common electrode wirings each extend in the firstdirection at a position which does not overlap with the transducersection and the signal electrode wirings in the plan view.
 12. Anultrasonic measurement apparatus comprising: an ultrasonic transducerdevice including a substrate, an ultrasonic element array having aplurality of ultrasonic element rows each including a plurality ofultrasonic elements arranged along a first direction and electricallyconnected to each other, the plurality of ultrasonic element rows beingarranged along a second direction intersecting with the first direction,a plurality of common electrode wirings each configured to independentlysupply a common voltage to at least one of the ultrasonic element rows,the common electrode wirings extending along the first direction, one ofthe common electrode wirings being arranged between a pair of theultrasonic element rows with respect to the second direction, and aplurality of signal electrode wirings configured to supply or receivesignals with respect to the ultrasonic element rows; a first flexiblesubstrate including a plurality of first signal wirings; and a secondflexible substrate including a plurality of second signal wirings,wherein the first signal wirings are respectively connected to firstends of the signal electrode wirings, and the second signal wirings arerespectively connected to second ends of the signal electrode wirings.13. The ultrasonic measurement apparatus according to claim 12, furthercomprising: a first integrated circuit device mounted on the firstflexible substrate and has a plurality of first transmission circuits;and a second integrated circuit device mounted on the second flexiblesubstrate and has a plurality of second transmission circuits, whereineach of the first transmission circuits is configured to output atransmission signal to a corresponding one of the first signal wirings,and each of the second transmission circuits is configured to output atransmission signal to a corresponding one of the second signal wirings.14. A head unit of a probe comprising: the ultrasonic transducer deviceaccording to claim 1, wherein the ultrasonic transducer device isconfigured to be attached and detached with respect to a probe body ofthe probe.
 15. A probe comprising: the ultrasonic transducer deviceaccording to claim 1; and a probe body.
 16. An ultrasonic imagingapparatus comprising: the ultrasonic transducer device according toclaim 1; and a display section configured to display image data.
 17. Anultrasonic device comprising: a plurality of ultrasonic element rows inwhich a plurality of ultrasonic elements are arranged; and a pluralityof common electrode lines connected to the ultrasonic element rows,respectively, the common electrode lines each being configured toindependently supply a common voltage to at least one of the ultrasonicelement rows, the common voltage being supplied from both ends of eachof the common electrode lines.